Polyimides (Figure 2.58) are typically prepared by reacting a tetracarboxylic acid anhydride such as pyromellitic dianhydride with aromatic diamines such as 4,4’-diaminodiphenylether. Heat resistance of greater than 250 °C during continuous exposure can be obtained using coatings based on such binders. Polyimides are thermoplastics that are difficult to dissolve and are therefore used as a binder in specialty coating applications such as in high temperature and high insulation coatings.
Another variant of such resins having both imide and amide linkages is prepared by the reaction of a low MW amine-capped polyamide with pyromellitic dianhydride. Such resins have been used to give good adhesion, hardness, and resistance properties to flexographic inks.