Polyimides and polyamide-imides

Polyimides and polyamide-imides

Polyimides (Figure 2.58) are typically prepared by reacting a tetracarboxylic acid anhydride such as pyromellitic dianhydride with aromatic diamines such as 4,4’-diaminodiphenylether. Heat resistance of greater than 250 °C during continuous exposure can be obtained using coatings based on such binders. Polyimides are thermoplastics that are difficult to dissolve and are therefore used as a binder in specialty coating applications such as in high temperature and high insulation coatings.

Another variant of such resins having both imide and amide lin­kages is prepared by the reaction of a low MW amine-capped poly­amide with pyromellitic dianhydride. Such resins have been used to give good adhesion, hardness, and resistance properties to flexo­graphic inks.

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