24 сентября, 2015 
Malyar Protection of components or of the entire circuit board against environmental influences is necessary in many fields of application to ensure proper operation. For this purpose special sealants and encapsulants based on curable epoxies, acrylates, and silicons were developed. Polyurethanes and polyimides are also used as encapsulants and sealings but have only limited importance. Requirements for sealings and encapsulants are:
1. Good wetting of the substrate and sufficient adhesion
2. Resistance against high and low temperatures, moisture, and corrosive media
3. Good processibility
4. Adjusted rheological behavior
5. Good elasticity to withstand mechanical stresses
Опубликовано в рубрике 