Лако-красочные материалы — производство

Monika Bauer and JUrgen Schneider

Fraunhofer Institute of Applied Materials Research, Teltow, Germany

I. INTRODUCTION

Although the application of adhesives in the electronics industry is widespread, the pro­duction of printed circuit boards (PCBs) creates a demand for a wide spectrum of proper­ties. Technical progress by research and development leads to more miniaturization of components and circuits, to a higher level of integration of printed circuits, and therefore to higher electrical power evolved per square unit. This trend continues. A lot of problems arising from this development could be solved by using special adhesives, sealants, or laminating resins only.

The aim of this short overview is to define the requirements of the electronics industry for adhesives, to derive their profile of properties, and to describe the state of the art. Additionally, encapsulating and sealing materials as well as binders for laminates are treated if there are analogous requirements regarding their properties. One well-known example of this situation is FR4-based material for PCBs, where the epoxy resin acts simultaneously as an adhesive for the copper foil and as a binder for the laminate. The primary fields for application of adhesives in the production of electronic circuits are adhesives for surface-mounted devices (SMDs), binders for laminates and/or adhesives for PCB base material, encapsulating and sealing materials for separate electronic com­ponents or complete circuits, and adhesive tapes used, for example, for flexible keyboards, feeding tapes, and covering materials. A variety of products are commercially available for all these applications.