Лако-красочные материалы — производство

Isotropically conductive adhesive interconnections can be repaired using techniques simi­lar to those used for solder rework. By application of heat locally at a temperature above the Tg value, a section of adhesive can be softened and the device can be removed mechanically. Adhesive residue on the substrate can be removed, if desired, by a mild scraping action. Clean components can be reassembled with the addition of fresh adhesive and the assembly can be cured either by additional application of local heat or by repeat­ing the original cure cycle [59]. Anisotropically conductive adhesive interconnections are more difficult to repair, due to the need to remove previously cured adhesive from all affected surfaces prior to reassembly. Thermoplastic matrices greatly facilitate the repair process.