OVERVIEW OF SPECTROSCOPIC TECHNIQUES

Table 1 lists a wide range of spectroscopic techniques with details on the type of informa­tion that these techniques can provide, their sampling depth, their sensitivity, and their major limitations. Some key references are provided for each technique. The techniques are classified in five major categories: ion spectroscopies, electron spectroscopies, x-ray spectroscopies, vibrational spectroscopies, and miscellaneous techniques. This distinction is, of course, arbitrary and is based on the type of signal that is recorded in each technique. It would be equally justifiable to classify the techniques on the basis of the primary beam or excitation source or even on sampling depth [3]. However, in each group a distinction has been made between those techniques that are well known and currently widely used and techniques that are either variations of the major techniques or still in a develop­mental stage. The techniques that are closely related or that are variations of the same main technique are grouped together.

Another way of comparing techniques is to group them according to the combina­tion of excitation (i. e., signal in) and response (i. e., signal out). This is frequently done in the literature [4]. This has been done here for a number of the techniques listed in Table 1. The results are shown in Table 2, which illustrates that a technique has been developed or proposed for almost all combinations of ions, electrons, and photons.

Table 1 indicates that the sampling depth for the various techniques varies from 1 monolayer to several millimeters. In general, the ion-based techniques, for instance SIMS and ISS, have the lowest sampling depths because the mean free path of ions in solids is not more than one or two monolayers. The penetration and escape depths for photons are much higher and, therefore, the techniques that are based on the detection of electromag­netic radiation, such as FTIR and XRF, give information on microns in metals and even millimeters in organics. This does not mean, however, that these techniques cannot detect monolayers. In suitable samples, both FTIR techniques and XRF can detect monolayers with high sensitivity, but it is difficult to restrict the signal acquisition to the monolayer only because of the larger sampling depths.

Methods based on electron detection have intermediate sampling depths. The sampled thickness in techniques such as AES and XPS is of the order of 50 A. Since the escape depth of an electron is dependent on its energy, the sampling depth in XPS and

Table 1 Spectroscopic Techniques for Use in Adhesive Bonding Studies

Technique

Acronym

Sampling

depth

Information

Sensitivity

Principle

Limitation

Ref.

A. Ion spectroscopies

Secondary ion mass spectrometry

SIMS

5 A

Mass spectrum;

All elements

Ion beam excitation

UHV;

7-9

Static SIMS

SSIMS

mapping;

^ monolayer

qualitative;

6

Time-of-flight SIMS

TOFSIMS

SNMS also

matrix effects;

28

Surface analysis by laser ionization

SALI

depth profile

12

Fast atom bombardment SIMS

FABSIMS

6

Secondary neutrals mass spectroscopy

SNMS

8

Laser microprobe mass analysis/

LAMMA,

1 pm

Mass spectrum

All elements

Laser excitation

Reproducibility;

105

spectrometry

LAMMS

of small area

damage

Laser ionization mass analysis

LIMA

Laser ionization mass spectrometry

LIMS

Ion scattering spectroscopy

ISS

2 A

Elements;

<1 monolayer

Ion beam scattering

Spectral

106

Low-energy ion scattering

LEIS(S)

heavier than

resolution

107

spectroscopy

primary ion

Medium-energy ion scattering

MEIS(S)

spectroscopy

High-energy ion scattering

HEIS(S)

spectroscopy

Rutherford backscattering

RBS

>1 pm

Depth profile;

High

Scattering;

Equipment cost

101-104

spectroscopy

nondestr.

meV ions

few elements

Neutral scattering spectrometry

NSS

108

Nuclear reaction analysis

NRA

1 pm

111

Electron-stimulated desorption

ESD

5 A

Mass spectrum;

<1 monolayer

e~ beam

Poor sensitivity;

109

spectroscopy

small spot

excitation

e~ damage

Electron-induced ion desorption

EIID

110

Electron-stimulated desorption ion

ESDIAD

angular distribution

(continued )

Technique

Acronym

Sampling

depth

Information

Sensitivity

Principle

Limitation

Ref.

Single photon ionization

SPI

As SIMS

Mostly as

Lower than SIMS

Postionization

Lower

12

Surface analysis by resonance

SARISA

SIMS; more

of sputtered

sensitivity

ionization of sputtered atoms

quantitative

neutrals

than SIMS

Resonantly enhanced multiphoton

REMPI

ionization

Non-resonant multiphoton ionization

NRMPI

spectroscopy

Hydrogen forward scattering

HFS

1-5 pm

H detection

H+, 4He+

H only

103

spectroscopy

beams

Forward recoil scattering

FRS

133

spectroscopy

B. Electron spectroscopies

Auger electron spectroscopy

AES

10-50 A;

Elements; >He;

0.1 at. -%

e~ beam

UHV;

14, 18

Scanning Auger microscopy

SAM

to 1 pm

depth profiles

excitation;

conductors

X-ray induced Auger electron

XAES

in depth

e~ detection

only; limited

spectroscopy

profiling;

chemical info

Ion-induced Auger electron

IIAES

mapping

8

spectroscopy

Ion neutralization spectroscopy

INS

112

Appearance potential spectroscopy

APS

113, 131

X-ray photoelectron spectroscopy

XPS

As in AES;

Electron spectroscopy for chemical

ESCA

UPS lower

Elements; >H;

0.1 at. -%

hv excitation;

UHV; mapping

14, 114

analysis

binding states

e~ detection

limited; low

UV photoelectron spectroscopy

UPS

sensitivity

Angular-resolved UV photoelectron

ARUPS,

115

spectroscopy

ARPES

Inverse photoemission spectroscopy Bremsstrahlung isochromat spectroscopy

IPES

BIS

17

Electron energy loss spectroscopy

EELS

50 A

All elements

0.1 at. -%

e excitation in

Low sensitivity

17

Scanning low energy electron

SLEELM

SEM/TEM

116, 117

energy loss microscopy

Ionization low spectroscopy

ILS

118, 132

C. X-ray spectroscopies

Energy-dispersive x-ray analysis

EDXA

1 pm

Elements; >B

0.01 at. -%

e~ beam; hv

No chemical

119

Wavelength dispersive x-ray

WDXA

PIXE less

detection

info; not

analysis

surface

Electron probe microanalysis

EPMA

sensitive

Particle-induced x-ray emission

PIXE

120

Extended x-ray fine structure

EXAFS

varies

Chemical states

Low

Oscill. in x-ray

Slow;

121, 122

spectroscopy

spectra

synchrotron

Surface extended x-ray fine

SEXAFS

structure spectroscopy

Near-edge x-ray absorption fine

NEXAFS

structure

X-ray absorption near edge structure

XANES

X-ray fluorescence

XRF

10 pm

Elements

0.001 at. -%

hv excitation

No chemical

and

info; no

detection

mapping

X-ray diffraction

XRD

10 pm

Crystal structure

Low

X-rays

Crystalline only

D. Vibrational spectroscopies

Fourier transform infrared

FTIR

10 pm

Molecules,

Low

Excitation of

Mainly

38, 40,

spectroscopy

functional

bonds by hv

qualitative

124

Diffuse-reflectance infrared Fourier

DRIFT

groups

transform spectroscopy

(continued )

Sampling

Подпись:Acronym depth Information Sensitivity Principle Limiatation Ref.

Attenuated total reflection ATR

spectroscopy

Reflection-absorption infrared RAIR

spectroscopy

Multiple reflection absorption MRAIR

infrared spectroscopy

Grazing incidence reflection GIR(S)

(spectroscopy)

Multiple reflection infrared MRS

spectroscopy

Multiple internal reflection MIR

(spectroscopy)

External reflection spectroscopy ERS

Surface reflectance infrared SRIRS

spectroscopy

Photoacoustic spectroscopy PAS

Emission spectroscopy EMS

Photothermal beam deflection PBDS

spectroscopy

Internal reflection spectroscopy IRS

Raman spectroscopy

RS

10 pm; 50 A Bonds and

Low

Scattered

Low sensitivity;

36, 62,

Laser Raman spectroscopy

LRS

in SERS molecules

photons

qualitative

70

Fourier transform Raman spectroscopy

FTRS

Hadamer transform Raman spectroscopy

HTRS

Surface-enhanced Raman spectroscopy

SERS

Resonance Raman spectroscopy

RRS

High-resolution electron energy loss spectroscopy

HREELS

50 At

Molecular vibrations

e excitation

Low resolution

37

Inelastic electron tunneling spectroscopy

IETS

1 monolayer

Molecular vibrations

Low

Excitation by voltage

Sample

preparation

125

Ellipsometry

Film thickness

Polarized

light

Sample

transparent

88, 91

Bombardment-induced light emission

BLE

126, 127

Glow-discharge optical spectroscopy

GDOS

> 10 pm

Depth profile of elements

High

Sputtering by Ar+ ions

Quantitative

99, 100

E. Other techniques

Low-energy electron diffraction Elastic low-energy electron diffraction Inelastic low-energy electron diffraction Reflection high-energy electron diffraction

LEED

ELEED

ILEED

RHEED

50 A

Crystalline

surface

structure

Limited

applicability

128,

129,

130

Mossbauer spectroscopy

MS

High

Chemical

Low

Absorption of

Limited no. of

134

Nuclear magnetic resonance Electron spin resonance

NMR

ESR

Bulk samples

environment of atom (e. g., Fe) Chemical state and free

High

g-rays by nucleus Resonance in magnetic

elements No surface info

Surface composition analysis by neutral and ion impact radiation

SCANIIR

spins

fields

8

Electrochemical impedance spectroscopy

EIS

Impedance of coated metal

Modeling

95, 96

Copyright © 2003 by Taylor & Francis Group, LLC

Table 2 Principles of Some Spectroscopic Techniques

Signal

Primary beam

Ions

Electrons

Photons

Neutrals

Vibrations

Ions

SIMS

IAES

PIXE

SNMS

BLE

ISS

INS

GDOS

SARISA

GDOS

RBS

GDMS

HFS

SCANIIR

Electrons

ESD

AES

EDXA

HREELS

ILS

WDXA

EELS

XES

LEED

SLEELM

EPMA

Neutrals

FAB

NSS

BLE

Photons

LAMMA

XPS

(S)EXAFS

FTIR

SALI

XAES

XANES

SERS

UPS

XRF

LRS

IPES

Ellipsometry

Voltage

FIM

STM

IETS

FEM

AES is not the same for all elements detected in the sample. Further, by varying the angle between the sample surface and analyzer, the sampling depth can be varied, resulting in a nondestructive quantitative concentration depth profile in the range 5-50 A. This feature is especially useful in XPS.

The type of information provided by the techniques listed in the tables also varies greatly. Many spectroscopic techniques give qualitative and/or quantitative elemental composition. The vibrational techniques, however, generally provide information on the molecular structure. SIMS, especially in the static mode (SSIMS or TOFSIMS), can yield information on molecular structures and even orientation of monolayers [5-10]. This is particularly useful for the study of the absorption of coupling agents on metals or to determine the effects of plasma treatments on polymer surfaces [11]. TOFSIMS instru­ments also have capabilities for determining the two-dimensional distributions of elements or molecular species at the surface, similar to the capabilities (for elements only) offered by AES and EDXA or WDXA.

The major technique for determining a depth profile of elemental compositions is AES. A newer technique for this purpose is SNMS, which has a better interface resolution (due to a lower sampling depth) than AES and a better sensitivity for many elements than AES [10,12,13]. In SNMS the neutrals emitted in the SIMS process are ionized and then mass-analyzed. The emission of neutrals is much less matrix-dependent than the emission of positive or negative ions detected in regular SIMS. Depth profiling can also be done in regular SIMS (the so-called dynamic SIMS version), but this technique then requires exten­sive calibration of sputtering rates and elemental sensitivities. Depth profiling in both AES and SIMS techniques is done by sputtering, usually by means of a beam of Ar+ ions.

The limitations of some of the more popular techniques are also given in Table 1. For many techniques, especially the more surface-sensitive ones (ion — and electron-based methods), an ultrahigh vacuum (UHV) environment is required. This requirement, of course, increases the cost of the equipment, but it also reduces the flexibility and applic­ability of the technique. Other limitations of certain techniques as indicated in the table are the difficult or complex sample preparation procedures, low sensitivity (long acquisition times), and poor resolution or element selectivity (e. g., ISS). Another limitation of some of the more sophisticated techniques is that they are not commercially available. To carry out certain techniques, it may be necessary to modify commercial instruments.

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