24 сентября, 2015 
Malyar The future development of electronical circuitries will be characterized by miniaturizing of components and circuits as well as a more and more dense packing of components on the printed circuit board. For this reason, the surface-mounting technology of electronical components will become more and more important. Additionally, using SMD techniques, a higher level of production of electronical circuitries can be reached. The preparation of special adhesives in one important precondition for the success of SMD techniques. In this connection it is essential to look for new reaction principles for one-component adhesives having higher curing rates at lower temperatures to increase the production rates and reduce the energy consumption and to replace the solder process by electrical — and/or thermal-conducting adhesion bondings.
The next era in loading technology has already begun. This technology is characterized by conducting tracks made in thin-layer technology by metal-sputtering processes and by electronical functions realized in thick-layer technology by structurated deposition of inorganic or organic pastes with well-defined electrical properties. Concerning this matter, the development of organic pastes with well-defined and adjustable electrical properties and rheological behavior is necessary.
In the future, environmental protection will become more and more a matter of concern. Harmless technologies and recycling processes for both the adhesives and the entire circuits will have to be developed. In this connection, the following requirements must be met by the polymeric materials
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