Лако-красочные материалы — производство

Epoxy resins offer a unique combination of properties for adhesive applications. These include the ability to formulate liquid systems without solvents or carriers, the ability to convert these systems to cured products without the production of low-molecular-weight by-products, the ability to bond dissimilar or nonporous surfaces, and the ability to produce thick sections without subsequent stress cracking due to shrinkage.

Although epoxy resin and hardener may be used in unmodified form in adhesive systems, most systems will consist of components that have been modified by incorpora­tion of various additives to achieve specific effects. Formulators will add catalysts or blend hardeners to obtain a specific usable life of the mix and to control the curing temperature. Reactive diluents may be added to modify viscosity or flexibility. Fillers impart improved compression strength and reduce shrinkage and cost. Solvents may be used to reduce viscosity or improve adhesion. Various additives may be added, usually at a low percen­tage, to reduce aeration, improve adhesion to difficult surfaces, or minimize settlement of fillers. Depending on the application, particular properties such as flame retardency, electrical insulation or conductivity, or chemical resistance may be improved by formulating.