23 сентября, 2015 
Malyar The chemistry of polymeric materials used for adhesives in the electronics industry does not differ from that of polymers for other applications. Taking into account the requirements mentioned in Section II, it becomes clear that reactive resins evolving no volatile substances during the curing process are of special interest. The following polymeric materials are of particular importance:
1. Expoxies [unmodified types of bisphenol A, higher functionalized resins, novolac epoxies, cycloaliphatic resins, heterocyclic resins; one — and two-component systems; curing at room temperature, at elevated temperatures, or by ultraviolet (UV) irradiation], used as mounting adhesives, coverings, and binders for laminates [1,2]
2. Acrylics (cyanoacrylates; anaerobic, by heating or UV-irradiation cross-linking acrylates) for mounting adhesives, sealants, and for adhesive tapes [2,3]
3. Silicone resins (at room temperature or by heating and by UV-irradiation curing products) mainly for sealings and coverings [4]
4. Polyimides as mounting adhesives [1]
Since epoxies and acrylics are the most important base resins for adhesives in the electronics industry, they will be described in more detail.
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