Formation and Cross-linking of the Bond by Polycondensation (elimination of low molecular mass cleavage products during setting)

Polyhydroxymethyl compounds: phenol-formaldehyde resins, also in combination with poly(vinyl formal) resins, nitrile rubber or epoxy resins (as adhesive film), urea — formaldehyde resins, melamine — formaldehyde resins, resorcinol — formaldehyde res­ins. Uses: wood (plywood manufacture), metals.

Silicone adhesives, one-pack, setting under the influence of atmospheric moisture. Uses: glass, metals, ceramics, plastics; some substrates need a priming coat.

MS polymers, silane-alkoxy-modified prepolymers of polypropylene glycol), one-pack systems. Uses: Many surfaces; no primer necessary.

Polyurethane adhesives, one-pack, setting under the influence of atmospheric moisture. Uses: plastics, metals, silicate-containing materials.

Reactive polyurethane hot-melt adhesives, one-pack, setting under the influence of atmospheric moisture. Uses: bookbinding (high-quality perfect bindings), wood gluing, shoe manufacturing.

Polyimides and polybenzimidazoles. Uses: metals (for high thermal stressing).

2.2. Cross-linking of Polymeric Adhesive Components in the Bond. Rubber-to — metal bonding agents, e. g., halogenated polymers in conjunction with cross-linking agents; adhesion is obtained under vulcanization conditions (elevated temperature and pressure). Uses: natural and synthetic rubber to metals (structural elements for damp­ing vibration).

2.3. Ultraviolet/Electron Beam (UV/EB) Curing Adhesives. Special acrylic acid esters (monomers or oligomers). Uses: for laminating and for pressure-sensitive prod­ucts.

2.6. Conductive adhesives include electrically and thermally conductive materials. Most fillers that impart electrical conductivity also contribute to thermal conductivity, but thermally conductive adhesives that are electrically insulative are also available.

Комментирование и размещение ссылок запрещено.

Комментарии закрыты.