Chalk, aluminum oxide, silicates and kaolin are used as fillers to reduce costs and shrinkage during the curing process. Pyrogenic or precipitated silicic acids or bentonites allow the flow characteristics of epoxy resins to be regulated.
Fillers and Thixotroping Agents
10 сентября, 2015 
Pokraskin 
Опубликовано в рубрике Adhesive Bonding