The following list includes several commercial manufacturers of conductive adhesives commonly used for die attach as well as other interconnection applications. Many manufacturers sell both isotropically as well as anisotropically conductive materials. The list is not intended to be inclusive but merely to provide initial guidance.
Ablestik Laboratories AI Technology Chromerics, Inc.
Emerson & Cumings, Inc.
Epoxy Technology Furane Products Company Hitachi Master Bond Nippon Graphite Polyflex Circuits Quantum Materials Tra-Con, Inc.
Zymet, Inc.
Conductive adhesive use should grow in the future. Die attach adhesive manufacturers are continually improving their formulations and developing new products in response to changing requirements (e. g., low stress and ‘‘snap cure’’ formulations). Anisotropically conductive adhesive use will become more widespread, as glass displays become an increasingly significant portion of the electronics market. Widespread replacement of solder paste as an interconnection material for surface-mounted assembly is more difficult to forecast. Isotropically conductive adhesives will probably prove inadequate for very fine pitch components. The use of anisotropics will be contingent on the development of a continuous process technology, as well as the demonstration of robust reliability.