17 сентября, 2015 
Malyar Excellent electrical insulation makes epoxy systems suitable for potting and encapsulation of electrical and electronic components. Here use is made of one-pack epoxies employing latent curing agents such as dicyandiamide. At the curing temperature the system will have very low initial viscosity, ensuring good wetting and bubble release. The low residual stresses protect components from mechanical damage. Fillers or pigments may be added to render the cured article opaque.
The low shrinkage and good durability of epoxies also fits them for capable jointing compounds. Here a measure of flexibility is desirable. The cured article may need to be worked on from time to time, so systems that can be cut or peeled off may be required. Usable lives of 15 min to 1 h are the norm. Components should be selected for good water resistance (Section VI. E).
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