Principles of Polymer Networking and Gel Theory in Thermosetting Adhesive Formulations

A. Pizzi

Ecole Nationale Superieure des Technologies et Industries du Bois, Universite de Nancy I, Epinal, France

I. INTRODUCTION

The study of adhesion and adhesives involves many scientific approaches and in parti­cular many different scientific disciplines. From physics to applied engineering, from surface science to chemistry, be it analytical, organic, or physical, all have, and would have a contribution to make to the fields of adhesives and adhesion. Polymer science is, among others, one of the important ways to approach several fields of the science of adhesives. However, while polymer physics and perhaps the physical chemistry of polymers are extensively used in this field, not much work is found that reports the use of the principles of polymer chemistry and, in particular, of polymer networking and gelation theory in the applied formulation of adhesives, i. e. on how adhesives are made to achieve particular effects. While in many other fields this branch of science is used extensively, in adhesive formulation a variety of factors have contributed to the lack of its extensive use. The main cause of this is the relative unwillingness of this industry to abandon empirical research, this being an approach often successful in solving some applied adhesive problems. Notwithstanding this, important applicable results can be rapidly achieved from polymer gel theory if this science is properly applied to adhesive formulation, and these results are obtainable much more readily and with much less effort than by empirical research.

So, in this chapter the interest and importance of the polymer gel theory approach to the formulation of adhesives will be briefly shown and, in particular, we will limit this to thermosetting wood adhesives obtained by polycondensation such as phenol-formaldehyde-, urea-formaldehyde-, melamine-formaldehyde — and resorcinol-formaldehyde-based adhesives. The same approach is, however, very valid for other polycondensation resins, and also for adhesives obtained by routes other than polycondensation.

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