Лако-красочные материалы — производство

A lot of problems arising from the requirements for encapsulants and sealings can be solved using modified epoxy and acrylate resins [2,10]. Furthermore, silicones became important, which is due to their high heat resistance, good elasticity, maintenance of their electrical properties over a wide range of temperatures and frequencies, and non­flammability [4]. A special type […]

Protection of components or of the entire circuit board against environmental influences is necessary in many fields of application to ensure proper operation. For this purpose special sealants and encapsulants based on curable epoxies, acrylates, and silicons were developed. Polyurethanes and polyimides are also used as encapsulants and sealings but have only limited importance. Requirements […]

Adhesives of various rheological properties are available for the usual deposition processes: screen printing, pin transfer, and dispensing [7]. The adhesive droplet must have a definite height and size, which depend on the board design and the type of component, to bridge the distance between the surface of the circuit board and the electronical component. […]

1. Adhesives The most commonly used adhesives in the electronics industry are thermosetting one-component epoxy resins and UV-irradiation cross-linking acrylates [7]. Thermosetting epoxy resins. Generally, thermosetting epoxy resins are mixtures of the following: Resins 50-80 wt % Hardeners 20-50 wt % Accelerators 0-3 wt % Fillers, dyes, modifiers 0-20 wt % At this time, thermosetting […]

Mounting adhesives are needed for the fixation of components in circuit boards during the loading process using surface-mounting technology (SMT) prior to soldering. As an alternative method, electrical-conducting adhesives can be used for the fixation of components. The advantage of this technique is that the soldering process can be avoided. Using SMD components for loading […]

Examples of the resin components of expoxies are listed in Table 1. Several chemical substances can be used as hardeners for epoxies [5,6]. The two main groups of cross­linking agents used in industry are two or more functionalized amines and anhydrides of carboxylic acids. Cross-linking with amines is possible at room temperature as well as […]

The chemistry of polymeric materials used for adhesives in the electronics industry does not differ from that of polymers for other applications. Taking into account the require­ments mentioned in Section II, it becomes clear that reactive resins evolving no volatile substances during the curing process are of special interest. The following polymeric materials are of […]

As stated earlier, the main requirements for adhesives in the electronics industry result from the increasing miniaturization of the electronic devices, which is manifested in an increasing number of pins with decreasing distance between them. Therefore, both the number of leads per square unit of the circuit board increases and the conductor width decreases. Additionally, […]

Monika Bauer and JUrgen Schneider Fraunhofer Institute of Applied Materials Research, Teltow, Germany I. INTRODUCTION Although the application of adhesives in the electronics industry is widespread, the pro­duction of printed circuit boards (PCBs) creates a demand for a wide spectrum of proper­ties. Technical progress by research and development leads to more miniaturization of components and […]

The following list includes several commercial manufacturers of conductive adhesives commonly used for die attach as well as other interconnection applications. Many man­ufacturers sell both isotropically as well as anisotropically conductive materials. The list is not intended to be inclusive but merely to provide initial guidance. Ablestik Laboratories AI Technology Chromerics, Inc. Emerson & Cumings, […]