Trends in Hot-Melt Technology

Following developments reported in 2002, hot melts have been formulated for the paper and packaging industries which allow processing at temperatures around 100 °C, thus alleviating the thermal stress to which the hot melts and substrates to be joined are exposed [19] (see Section 8.5).

If the setting period of hot melts is very short, then the adhesive forces will not fully develop as the melt has insufficient time to optimally wet the surface of the substrate. Hence, in the printing industry a system was developed that allows perfect adhesion and rapid processing speed to be combined. First, a hot melt designed to show excellent adhesion properties is applied to the binding edges of the sheets, causing them to be glued together. A second adhesive is then applied that holds in place and fixes the cover to the book’s spine [19].

A new type of UV-reactive hot melt was created from UV-setting polyacrylates which have increasingly been used in the production of sticky labels and adhesive tapes. By modifying the intensity of the UV radiation, very different adhesion and cohesion properties may be conferred to the adhesive film applied from the melt [20].

A water-soluble hot melt was developed for the labels of reusable plastic bottles to facilitate their recycling.

Examples of adhesives with new functionalities are water-swellable hot melts used for example in communications cables. When these hot melts come into contact with water, they swell and thus seal the cable in its longitudinal direction [19].

5.4

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