The temperature resistance ofpolymer materials is often limited by thermal decomposition at elevated temperatures. However, by using a micro thermobalance the loss in weight of an adhesive sample can be monitored as a function of temperature. ASTM E2550, for example, covers a test method for the assessment of material thermal stability by determining the temperature at which the materials begin to decompose or react, and the extent of their mass change, using thermogravimetry.
Temperature Resistance by Thermogravimetry
15 октября, 2015 
Pokraskin 
Опубликовано в рубрике Adhesive Bonding