Hot-Melt Adhesive Systems

Hot-melt adhesive systems comprise versatile performance hot melts and applicators with auxiliary equipment for continuous use in industry (Figure 8.50). Hot-melt adhesives with 100% solids content have been developed from solvent-free thermo­plastic hot-melt resins. In the molten state, they are capable of wetting a surface and of developing a strong bond by means ofheat dissipation, without chemical reactions, to

Hot-Melt Adhesive Systems

Figure 8.50 Application systems for hot melts.

many different materials such as wood, board, paper, cork, leather, rubber, felt, textiles, plastics and foamed material, ceramics, glass and metals. They are not only well suited to the joining of different materials with themselves or with each other, but also for the sealing and filling of cavities and gaps. No clamping devices are necessary, and the final strength is achieved after only a few seconds. Performing applicators are available for processing.

Low-melt adhesives are applied at a relatively low melting point (120-130 °C), and perform as standard systems. They are especially suitable for materials that are sensitive to heat, such as thermoplastic foils or Styropor®, avoiding staining, shrinkage and warping. Furthermore, the danger of the materials to be burned, and the development of smoke or odors, are reduced to a minimum.

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